5 September 1997 Microsystem packaging in 3D
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Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284509
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
Packaging influences the reliability and performance of microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package is presented. Finite element techniques are used to analyze the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerard Kelly, Gerard Kelly, John C. Alderman, John C. Alderman, C. Lyden, C. Lyden, James Barrett, James Barrett, Anthony Morrissey, Anthony Morrissey, } "Microsystem packaging in 3D", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284509; https://doi.org/10.1117/12.284509
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