2 September 1997 Design and development of microstructures for MEMS applications
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Proceedings Volume 3226, Microelectronic Structures and MEMS for Optical Processing III; (1997) https://doi.org/10.1117/12.284571
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
A new approach has been proposed to realize suspended microstructures such as cantilevers, diaphragms, springs, spirals, etc. over pits of controlled depth in bulk silicon micromachining process using direct wafer bonding technology. The structures have been realized in heavily boron doped silicon and dielectric layers. The electrostatic actuation voltage of the cantilever beams have been computed as a function of physical parameters and compared with experimentally measured values. LPCVD polysilicon has been investigated with a view to obtain low stress films for use in surface micromachining technology. The effect of deposition parameters on stress in the polysilicon films has been studied. Post deposition annealing is shown to have profound effect on the stress properties of the polysilicon films. Rapid thermal annealing is found to be much more effective in reducing the stress compared to conventional furnace annealing. The advantage of direct wafer bonding technology for electrostatically actuated microstructures have been presented. The application of this technology for MEMS have been discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sudhir Chandra, Sudhir Chandra, Janak Singh, Janak Singh, Ami Chand, Ami Chand, } "Design and development of microstructures for MEMS applications", Proc. SPIE 3226, Microelectronic Structures and MEMS for Optical Processing III, (2 September 1997); doi: 10.1117/12.284571; https://doi.org/10.1117/12.284571
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