2 September 1997 Thermal management in planar optical systems with active components
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Proceedings Volume 3226, Microelectronic Structures and MEMS for Optical Processing III; (1997) https://doi.org/10.1117/12.284574
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
Planar integrated free-space optics has been suggested and demonstrated as a micro-optical systems technology for optical interconnection and processing. It is based on the integration of micro-optical elements on a single glass substrate. Active optoelectronic components are mounted onto the substrate using hybrid integration techniques. An important problem related to the packaging is the heat removal from these active device arrays. A high interconnection density -- which is desirable from an architectural point of view -- can cause a dissipated power on the order of 100 W/cm2. This may compromise the performance of individual devices and the system as a whole. As cooling mechanisms, we consider convection which requires sufficiently large surfaces and conduction in an intermediate layer of high thermal conductivity between the passive optics and the optoelectronics. Both, structured silicon coolers and diamond layers are of interest for a practical realization. Here, we discuss material and design aspects of heat spreaders. Both, theoretical modeling and experimental results are presented. A test setup including an array of vertical cavity surface emitting lasers (VCSELs) is analyzed. The temperature distribution on the array is determined experimentally by the shift of the optical wavelength. Computer simulations are used to evaluate the experimental data.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christiane Gimkiewicz, Juergen Jahns, "Thermal management in planar optical systems with active components", Proc. SPIE 3226, Microelectronic Structures and MEMS for Optical Processing III, (2 September 1997); doi: 10.1117/12.284574; https://doi.org/10.1117/12.284574
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