1 February 1998 Application of solvent bonding technique to achieve a highly reliable low-cost CATV PIN package
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Proceedings Volume 3234, Design and Manufacturing of WDM Devices; (1998) https://doi.org/10.1117/12.300924
Event: Voice, Video, and Data Communications, 1997, Dallas, TX, United States
Abstract
In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room- temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. As model has been developed as a design tool to simulate the responsivity and the optical back reflection of various configurations of different angled fibers and canted angles with respect to the PIN detector. Close agreement between simulations and measurements of responsivity and optical back reflection has been achieved. With this design tool, a low cost pigtailed PIN module utilizing a novel solvent bonding technique has been developed to meet CATV applications.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ching Long Jiang, Steve O'Neill, Hai Sheng Wang, "Application of solvent bonding technique to achieve a highly reliable low-cost CATV PIN package", Proc. SPIE 3234, Design and Manufacturing of WDM Devices, (1 February 1998); doi: 10.1117/12.300924; https://doi.org/10.1117/12.300924
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