High-density interconnect substrates and device packaging using conductive composites

Pradeep Gandhi; Catherine Gallagher; Goran Matijasevic

doi:10.1117/12.300919

Translator Disclaimer

1 February 1998 High-density interconnect substrates and device packaging using conductive composites

Pradeep Gandhi, Catherine Gallagher, Goran Matijasevic

Author Affiliations +

Proceedings Volume 3234, Design and Manufacturing of WDM Devices; (1998) https://doi.org/10.1117/12.300919
Event: Voice, Video, and Data Communications, 1997, Dallas, TX, United States

Abstract

High-end printed circuit board manufacturing technology is receiving increasing attention due to higher functionality in smaller form factors. This is evident from the industry efforts to produced reliable microvias and related trace features to pack as much circuit density as possible. Cost, density and performance requirements have prodded entry into a market that was mainly reserved for ceramic and molded packages for the last forty years. To successfully meet the demanding specifications of this market segment, a worldwide effort is underway for the development of new materials, processes and equipment. A novel base technology that is applicable to most of the major packaging and redistribution elements in an electronic module is presented.High density multilayer circuits with landless blind and buried vias can be fabricated by filling the conductor paste into photoimaged dielectrics and thermally processing it at a relatively lower temperature. Via layers are prepared directly on the inherently planarized circuit layer in an identical fashion. Because these composite materials are applied in an additive fabrication method, metal substrates can be employed for high thermal dissipation and excellent CTE control over a wide temperature range. The conductor material is based on interpenetrating polymer and metal networks that are formed in situ from metal particles and a thermosetting flux/binder. The metal network is formed when the alloy particles melt and react with adjacent high melting point metal particle. Interaction also occurs between the alloy particles and pad, lead or previous trace metallizations provided they are solderable by alloys of tin. The new alloy composition created by the interdiffusion process within the bulk material has a higher melting point than the original alloy and thus solidifies immediately upon formation. This metallurgical reaction, known as transient liquid phase sintering, is facilitated by the polymer mixture. INtegration of the polymer and metal networks is maintained by utilizing a thermosetting polymer system that cures simultaneously with the metallurgical reaction. Although similar in concept and performance to cermet inks, these compositions differ in that their process temperatures are compatible with conventional printed wiring board materials and that the polymeric binder remains to provide adhesion and fatigue resistance to the metallurgical network.

Citation Download Citation

Pradeep Gandhi, Catherine Gallagher, and Goran Matijasevic "High-density interconnect substrates and device packaging using conductive composites", Proc. SPIE 3234, Design and Manufacturing of WDM Devices, (1 February 1998); https://doi.org/10.1117/12.300919

ACCESS THE FULL ARTICLE