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14 November 1997 Discussion of integrated circuit (IC), multichip module (MCM), and MEMS applications fabricated through MOSIS
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Abstract
Since inception 16 years ago, the MOSIS Service at the Information Sciences Institute of the University of Southern California has processed over thirty thousand (30 K) IC Designs. Three years ago, it added access to commercial multichip module (MCM) fabrication through MIDAS. To the list of standard offerings, MOSIS now introduces back end processing of MOSIS custom VLSI circuits for both suspended structure and diaphragm style MEMS. MOSIS presents an array of high-end VLSI technologies from various domestic foundries' standard processes for prototype and small volume quantities. Thus designers can develop low-cost ICs, MCMs and (now) MEMS with a one-stop-shopping electronic commerce style service. MOSIS functions as a 'transparent' third party interface between design and fabrication. The service offers ease of use through supported standard cell libraries and design tools, and with Internet design submission. Sharing the costs of NRE, masks and fabrication provides a low cost environment for users. MOSIS handles the front-end foundry tasks of data preparation and mask fabrication with fixed domestic and international price lists. MOSIS utilizes volume production lines at AMI, HP, Orbit, Vitesse, and MicroModule Systems (MMS). This paper discusses what MOSIS offers to the VLSI design community, various applications fabricated through the service, as well as a conceptual design that draws from the various technologies discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jennifer Peltier and Wes Hansford "Discussion of integrated circuit (IC), multichip module (MCM), and MEMS applications fabricated through MOSIS", Proc. SPIE 3241, Smart Materials, Structures, and Integrated Systems, (14 November 1997); https://doi.org/10.1117/12.293531
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