14 November 1997 Measurement of thermal expansion coefficient of poly-Si using microgauge sensors
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Thermal expansion coefficient of heavily doped LPCVD polycrystalline thin film was extracted by microgauge sensors. When electrical power was applied to the microgauge, it was heated up and thermal expansion occurred. From the relation between applied current and measured displacement at the microgauge, thermal expansion coefficient of thin film was extracted. The results revealed a value of 2.9 X 10-6 /K of thermal expansion coefficient of highly doped poly-Si thin films with standard deviation of 0.24 X 10-6 /K.
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Jung Hun Chae, Jung Hun Chae, Jae-Youl Lee, Jae-Youl Lee, Sang Won Kang, Sang Won Kang, } "Measurement of thermal expansion coefficient of poly-Si using microgauge sensors", Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); doi: 10.1117/12.293562; https://doi.org/10.1117/12.293562

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