14 November 1997 New vacuum packaging method of field emission display
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Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si- 7740 and Ti-(Li-doped SiO$02)) interlayer systems can be employed for the electrostatic bonding of 7059-7059 and 0080-0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Byeong-Kwon Ju, Byeong-Kwon Ju, Woo-Beom Choi, Woo-Beom Choi, S. J. Jeong, S. J. Jeong, Nam Young Lee, Nam Young Lee, Jeong-In Han, Jeong-In Han, K. I. Cho, K. I. Cho, Myung-Hwan Oh, Myung-Hwan Oh, } "New vacuum packaging method of field emission display", Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); doi: 10.1117/12.293566; https://doi.org/10.1117/12.293566

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