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8 July 1998 Noncontact ultrasonic ULSI process metrology using ultrafast lasers
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Abstract
Subpicosecond laser ultrasonic techniques have been used for nearly a decade to study the physical and chemical properties of thin films and multilayers. Recent advances in computational methods, optical design and laser technology have made it possible to develop further related techniques for thin film process metrology. In this paper we describe the principles and applications of picosecond ultrasonics, with an emphasis on in-line characterization of metal and dielectric films used in ULSI chip manufacturing. Topics to be discussed include measurements of simple metal films ranging from 50 A to 2 microns thick, and opaque multilayers consisting of up to six sequentially deposited metal films.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert J. Stoner, Christopher J. Morath, Guray Tas, Samit S. Sengupta, Sailesh M. Merchant, Jeffery B. Bindell, and Humphrey J. Maris "Noncontact ultrasonic ULSI process metrology using ultrafast lasers", Proc. SPIE 3269, Commercial Applications of Ultrafast Lasers, (8 July 1998); https://doi.org/10.1117/12.312336
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