Paper
3 June 1998 Light-induced dry etching of semiconductors in the vacuum ultraviolet
Udo Streller, Heribert Raaf, Nikolaus Schwentner
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Abstract
The dry etching of Si with XeF2 and of GaAs with Cl2 in a wavelength range around 120 nm combines very high efficiency with excellent selectivity and provides a perspective to reach lateral resolutions required in about 10 years. Projection optics based on conventional optical materials and light sources seem to be feasible. The high quantum efficiencies between 10 and 100 removed atoms per photon originate from chain reactions. The relevant reactions are initiated by excitation of surface layers which provides the high selectivity. Optimal etching conditions concerning dark reaction and nonselective reactions are specified. The influence of the chain reactions on the topography is investigated.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Udo Streller, Heribert Raaf, and Nikolaus Schwentner "Light-induced dry etching of semiconductors in the vacuum ultraviolet", Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); https://doi.org/10.1117/12.309501
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Cited by 1 scholarly publication.
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KEYWORDS
Etching

Silicon

Gallium arsenide

Absorption

Photomasks

Quantum efficiency

Dry etching

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