15 March 1998 Nonsilicon micromachining for MOEMS elements
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Abstract
For many MEMS devices, silicon including polysilicon so far is the most idea materials, therefore the silicon micromachining technology has been well developed. However, for some MOEMS devices and systems, using other materials such as glasses, quartz, dielectric and ferroelectric crystals or ceramics, compound semiconductors, metals and alloys are also available or unique. As a result, it is necessary to develop the nonsilicon micromachining technology. In this paper, the nonsilicon micromachining process and some devices such as different kinds of micro- hinges will be reported.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi-Xin Chen, Xiaolin Zhao, Zongguang Wang, "Nonsilicon micromachining for MOEMS elements", Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); doi: 10.1117/12.302403; https://doi.org/10.1117/12.302403
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