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Monolithic wavelength-graded VCSEL and wavelength-selective photodetector arrays for wavelength-division-multiplexed optical interconnect applications
Flip-chip-joined 8x8 array of bottom-emitting 850-nm light-emitting diodes for interconnect applications
New method for grafting a thin film metal-semiconductor-metal photodetector with a transimpedence amplifier and applications to multichip module packaging
High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging
Four-channel multimode wavelength-division-demultiplexer (WDM) system based on surface-normal volume holographic gratings and substrate-guided waves