5 May 1998 Guided-wave optoelectronic clock-distribution networks on multichip modules using MEMS fabrication techniques
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Abstract
This paper addresses the design, fabrication, and packaging issues of optoelectronic clock distribution networks on multichip modules (MCM) by combining guided-wave optoelectronic interconnect, MCM packaging, and microelectromechanical system fabrication techniques. The proposed prototype employs the silica glass waveguide networks on silicon substrates and innovative I/O coupling method which utilizes the micromachined through-holes across MCM substrates and silicon mirror arrays. Microstructures for I/O coupling have been fabricated using KOH etchants at various processing conditions and the silica glass optical waveguide networks are fabricated using FHD and RIE processes. The four fanout optoelectronic clock distribution networks are prototyped and characterized by measuring the overall insertion losses and the power equalities at the fanout nodes.
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Seungug Koh, Seungug Koh, Sung-Dong Suh, Sung-Dong Suh, Danjin Wu, Danjin Wu, Mark Lantz, Mark Lantz, } "Guided-wave optoelectronic clock-distribution networks on multichip modules using MEMS fabrication techniques", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307563; https://doi.org/10.1117/12.307563
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