5 May 1998 Realization of holographic optical interconnects for a multichip module on silicon
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Abstract
The design, assembly and packaging of a multichip module on silicon with a holographic-optical 1 to 4 interconnect is presented. The potential of the system containing commercially available components is demonstrated. Holographic optical elements in dichromated gelatine as well as computer-generated holograms are used to distribute and focus a clock signal generated by a vertical-cavity surface-emitting laser diode onto silicon photodiodes. The two different kinds of holograms are compared with respect to their efficiency, fabrication effort and compatibility with the demands of a microelectronic system. Alignment issues, thermal behavior and the total optical link efficiency are discussed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans-Ulrich Grubert, Hans-Ulrich Grubert, } "Realization of holographic optical interconnects for a multichip module on silicon", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307583; https://doi.org/10.1117/12.307583
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