20 April 1998 New premolded package with optical fiber guide pipe
Author Affiliations +
A new pre-molded organic package with optical fiber guide pipe has been developed to meet the demand of significant package cost reduction in subscriber systems. The new pre- molded package is composed of a new organic materia which has high anti-moisture reliability. The new pre-molded package has not degraded after reliability test including thermal shock, temperature cycling and PCT of 0 to 100C/500 cycle, -40 to 84 C/500 cycle and 121C/2atm, respectively. The new developed pre-molded package with the guide pipe can be used in the subscriber systems with low- cost effect and high reliability.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shigeo Tanahashi, Mitsugu Uraya, Nobuyuki Takehashi, Mitsuo Yanagisawa, Satoru Tomie, "New premolded package with optical fiber guide pipe", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305475; https://doi.org/10.1117/12.305475


Stress free aging of optical fiber in water and humid...
Proceedings of SPIE (February 25 1993)
Reliability evaluation for PON power splitters
Proceedings of SPIE (September 28 1994)
Reliability of optical connectors and splices
Proceedings of SPIE (March 01 1994)
New package for CMOS sensors
Proceedings of SPIE (February 19 2004)

Back to Top