Techniques and applications for integrating a semiconductor laser on a micromachined die

Joseph G. Bouchard Jr.; Victor M. Bright; David M. Burns

doi:10.1117/12.305480

20 April 1998 Techniques and applications for integrating a semiconductor laser on a micromachined die

Joseph G. Bouchard Jr., Victor M. Bright, David M. Burns

Proceedings Volume 3289, Micro-Optics Integration and Assemblies; (1998) https://doi.org/10.1117/12.305480
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

This paper describes methods for attaching a vertical cavity surface emitting laser (VCSEL) on to a surface micromachined die. Techniques investigated include silver paste, soldering, wire bonding, and gold pads with integrated resistive heaters. Each technique is evaluated based on reliability, positioning tolerances, and secondary effects. Applications include single chip laser beam scanning.

Citation Download Citation

Joseph G. Bouchard Jr., Victor M. Bright, and David M. Burns "Techniques and applications for integrating a semiconductor laser on a micromachined die", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); https://doi.org/10.1117/12.305480

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