20 April 1998 Techniques and applications for integrating a semiconductor laser on a micromachined die
Author Affiliations +
Abstract
This paper describes methods for attaching a vertical cavity surface emitting laser (VCSEL) on to a surface micromachined die. Techniques investigated include silver paste, soldering, wire bonding, and gold pads with integrated resistive heaters. Each technique is evaluated based on reliability, positioning tolerances, and secondary effects. Applications include single chip laser beam scanning.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph G. Bouchard, Victor M. Bright, David M. Burns, "Techniques and applications for integrating a semiconductor laser on a micromachined die", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305480; https://doi.org/10.1117/12.305480
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT

Design techniques for surface-micromachining MEMS processes
Proceedings of SPIE (September 19 1995)
MEMS actuated deformable mirror
Proceedings of SPIE (January 23 2006)
SU-8 focus control mirrors released by XeF2 dry etch
Proceedings of SPIE (February 14 2011)
High-speed wavefront control using MEMS micromirrors
Proceedings of SPIE (August 23 2005)
Variable-focal-length microelectromechanical lens
Proceedings of SPIE (April 20 1998)

Back to Top