20 April 1998 Techniques and applications for integrating a semiconductor laser on a micromachined die
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Abstract
This paper describes methods for attaching a vertical cavity surface emitting laser (VCSEL) on to a surface micromachined die. Techniques investigated include silver paste, soldering, wire bonding, and gold pads with integrated resistive heaters. Each technique is evaluated based on reliability, positioning tolerances, and secondary effects. Applications include single chip laser beam scanning.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph G. Bouchard, Joseph G. Bouchard, Victor M. Bright, Victor M. Bright, David M. Burns, David M. Burns, } "Techniques and applications for integrating a semiconductor laser on a micromachined die", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305480; https://doi.org/10.1117/12.305480
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