20 April 1998 Thin film Au-Sn bonding for optoelectronic integration
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Abstract
Eutectic bonding employing vacuum-deposited Au and Sn precursor layers, and based on a novel process, can effect quasi-monolithic hybridization of thin-film III-V devices with silicon substrates.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John J. Callahan, Timothy J. Drabik, Kevin P. Martin, Chi Fan, "Thin film Au-Sn bonding for optoelectronic integration", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305490; https://doi.org/10.1117/12.305490
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