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22 December 1997 Heterogeneous integration of optoelectronic components
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The heterogeneous integration of optoelectronic, electronic, and micro-mechanical components from different origins and substrates makes possible many advanced systems in diverse applications. Besides the monolithic integration approach, which is the basis for the success of today's silicon industry, various hybrid integration technologies have been explored. These include flip-chip bonding, micro-robotic placement, epitaxial lift-off and direct bonding, substrate removal and bonding, and several self-assembly methods. In this paper, we describe the results of our monolithic integration effort involving a 2 by 2 optoelectronic switching circuit and an 8 by 8 active-pixel sensor array on GaAs substrates, and a 16 by 16 spatial light modulator array produced by flip-chip bonding of III-V multi-quantum-well (MQW) modulators and silicon driver circuits. We also present our preliminary experimental results on the self-assembly of small inorganic devices coated with DNA polymers with self- recognition properties.
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Chi Fan, David W. Shih, Mark W. Hansen, Daniel M. Hartmann, Daniel A. Van Blerkom, Sadik C. Esener, and Michael J. Heller "Heterogeneous integration of optoelectronic components", Proc. SPIE 3290, Optoelectronic Integrated Circuits II, (22 December 1997);

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