Application of anisotropic conductive films for realization of interconnects in micromechanical structures

In-Byeong Kang; Malcolm R. Haskard; Noel D. Samaan

doi:10.1117/12.305553

16 April 1998 Application of anisotropic conductive films for realization of interconnects in micromechanical structures

In-Byeong Kang, Malcolm R. Haskard, Noel D. Samaan

Author Affiliations +

Proceedings Volume 3321, 1996 Symposium on Smart Materials, Structures, and MEMS; (1998) https://doi.org/10.1117/12.305553
Event: Smart Materials, Structures and MEMS, 1996, Bangalore, India

Abstract

A new micromachining process, the application of an anisotropic conductive film (ACF) for micromechanical structures as well as interconnection both mechanically and electrically, is reported. The film acts as a spacer and adhesive as well as an electrical conductor in the vertical direction. The process provides very flexible design scheme and simple fabrication process. New micropump structure was proposed, and simple microstructures have been fabricated and tested successfully. The full details of experiment are reported, experiments where ACF type CP 7621 (Sony Chemical Co) was used to bond p type (100) silicon wafers.

Citation Download Citation

In-Byeong Kang, Malcolm R. Haskard, and Noel D. Samaan "Application of anisotropic conductive films for realization of interconnects in micromechanical structures", Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); https://doi.org/10.1117/12.305553

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