16 April 1998 Technologies for integrated sensors and actuators
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Proceedings Volume 3321, 1996 Symposium on Smart Materials, Structures, and MEMS; (1998) https://doi.org/10.1117/12.305589
Event: Smart Materials, Structures and MEMS, 1996, Bangalore, India
Abstract
The demand for small, low-cost, and reproducible sensors and actuators has lead to the use of the silicon IC-technology for the realization of these devices. To include the required function of the sensor or actuator in the silicon, special processing is often required. Micromachining, thin film deposition and wafer-to-wafer bonding processes have been developed for the realization of sensor and actuator systems. By making these processes compatible to silicon integrated circuit (IC) processing, an additional advantage is obtained: the possibility of integrating electronic circuitry with the sensor or actuator on one silicon chip which allows the development of smart sensors. In this paper some special technologies for integrated sensors and actuators are reviewed. Special attention is given to the newly developed IC-compatible wafer-to-wafer silicon fusion bonding, because this process is expected to accelerate the commercial realization and application of smart sensor and actuator systems.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael J. Vellekoop, Pasqualina M. Sarro, "Technologies for integrated sensors and actuators", Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); doi: 10.1117/12.305589; https://doi.org/10.1117/12.305589
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