16 June 1998 Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments
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Abstract
A magnetostrictive wire-bonding clamp for use in semiconductor packaging applications has been developed by Mechatronic Technology Co. Semiconductor industry trends, requiring high process throughput on increasing lead count packaging, make the magnetostrictive material Terfenol-D a candidate for this application. To construct this small, lightweight device, small samples of Terfenol-D were prepared by ETREMA Products, Inc. This paper reports the initial design, mathematical modeling, and experiments related to this initial prototype.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David M. Dozor, David M. Dozor, } "Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments", Proc. SPIE 3326, Smart Structures and Materials 1998: Industrial and Commercial Applications of Smart Structures Technologies, (16 June 1998); doi: 10.1117/12.310668; https://doi.org/10.1117/12.310668
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