20 July 1998 CMOS MEMS technology and CAD: the case of thermal microtransducers
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Abstract
Thermally-based transducer microsystems can be made by using CMOS IC technology, post-CMOS micromachining or deposition, and flip-chip packaging. Technology steps, materials, and physical effects pertinent to thermal microtransducers are summarized together with microheater, thermistor, thermopile, thermal isolation, and heat sink structures. An infrared intrusion detector, a thermal air flow sensor, and thermally excited microresonators for acoustic and chemical sensing serve as demonstrators. We discuss the characterization of process-dependent properties of CMOS materials crucial for thermal microtransducer CAD.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henry Baltes, Oliver Brand, Oliver Paul, "CMOS MEMS technology and CAD: the case of thermal microtransducers", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320157; https://doi.org/10.1117/12.320157
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