20 July 1998 Electroless Cu plating of alumina treated with cw CO2 laser radiation
Author Affiliations +
Abstract
For the production of conductive structures in insulating ceramics UV excimer laser radiation is often used in two- step processes first to activate alumina, while the metal deposition is carried out subsequently from special solutions for electroless metal plating. An alternative process for obtaining conductive traces in alumina surface has been reported recently. However, the resulting conductivity is still far from the values required by fast progresses in packaging technology. In this paper the modification process is investigated with respect to the ability of the selectively laser-modified, alumina to promote electroless metal deposition. This is of basic interest because sources of CO2 radiation are more stable and easier to handle in comparison to sources of excimer radiation. Moreover the described process can be considered as an alternative way of alumina activation. It is shown that alumina treated with cw CO2 laser radiation under an ethanol layer takes on the ability to reduce Cu from its electroless plating bath which permits to significantly increase the conductivity of the laser- modified conductive tracers.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Beate Stolz, Beate Stolz, S. Geisler, S. Geisler, George A. Shafeev, George A. Shafeev, A. V. Simakin, A. V. Simakin, Ernst-Wolfgang Kreutz, Ernst-Wolfgang Kreutz, Reinhart Poprawe, Reinhart Poprawe, } "Electroless Cu plating of alumina treated with cw CO2 laser radiation", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320194; https://doi.org/10.1117/12.320194
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT

Coupling Coefficients For Laser Radiation On Metals
Proceedings of SPIE (November 11 1986)
Molten targets in pulsed laser deposition
Proceedings of SPIE (May 25 1998)
High-precision machining with copper bromide laser
Proceedings of SPIE (June 20 2004)
Laser light induced dissipative structures on solid surfaces
Proceedings of SPIE (September 30 1990)

Back to Top