20 July 1998 Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds
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Abstract
We present a packaged single-chip microsystem for the detection of organic vapors. The sensor is fabricated using a 0.8 micrometers CMOS IC process provided by AMS Austria Mikro Systeme. Volatile organic compounds are detected by measuring the capacitance change of three polymer coated interdigitated capacitors due to analyte absorption. To protect the read-out circuitry from the organic vapors, the device is packaged using flip-chip technology. This technology allows for openings in the ceramic substrate for the sensing capacitors while hermetically sealing the remaining chip area. Measurements for different volatile organic compounds and chemically sensitive polymer layers are presented. The packaged microsensor array is a first step towards the realization of a small, low cost electronic nose on a single chip.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Koll, Shoji Kawahito, Felix Mayer, Christoph Hagleitner, D. Scheiwiller, Oliver Brand, Henry Baltes, "Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320173; https://doi.org/10.1117/12.320173
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