Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds

Andreas Koll; Shoji Kawahito; Felix Mayer; Christoph Hagleitner; D. Scheiwiller; Oliver Brand; Henry Baltes

doi:10.1117/12.320173

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20 July 1998 Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds

Andreas Koll; Shoji Kawahito; Felix Mayer; Christoph Hagleitner; D. Scheiwiller; Oliver Brand; Henry Baltes

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Proceedings Volume 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS; (1998) https://doi.org/10.1117/12.320173
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

We present a packaged single-chip microsystem for the detection of organic vapors. The sensor is fabricated using a 0.8 micrometers CMOS IC process provided by AMS Austria Mikro Systeme. Volatile organic compounds are detected by measuring the capacitance change of three polymer coated interdigitated capacitors due to analyte absorption. To protect the read-out circuitry from the organic vapors, the device is packaged using flip-chip technology. This technology allows for openings in the ceramic substrate for the sensing capacitors while hermetically sealing the remaining chip area. Measurements for different volatile organic compounds and chemically sensitive polymer layers are presented. The packaged microsensor array is a first step towards the realization of a small, low cost electronic nose on a single chip.

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Andreas Koll, Shoji Kawahito, Felix Mayer, Christoph Hagleitner, D. Scheiwiller, Oliver Brand, and Henry Baltes "Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320173

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KEYWORDS

Sensors

Microsystems

Capacitors

Packaging

Polymers

Ceramics

Chemical analysis

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