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20 July 1998 MEMS packaging: state of the art and future trends
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Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andre Bossche, Carmen V. B. Cotofana, and Jeff R. Mollinger "MEMS packaging: state of the art and future trends", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998);

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