Analysis and identification of factors contributing to the overlay budget

Klaus Simon; R. Macklin; Robert A. Selzer; Olga Vladimirsky; Yuli Vladimirsky; Franco Cerrina

doi:10.1117/12.309567

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5 June 1998 Analysis and identification of factors contributing to the overlay budget

Klaus Simon, R. Macklin, Robert A. Selzer, Olga Vladimirsky, Yuli Vladimirsky, Franco Cerrina

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Proceedings Volume 3331, Emerging Lithographic Technologies II; (1998) https://doi.org/10.1117/12.309567
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

The most important contributions to overlay inaccuracy are coming from well-known sources like mask pattern placement accuracy, alignment system accuracy and stage performance of the exposure tools. As the allowances for overlay budget decrease, and improvements in mask fabrication and stage performance are made, a number of previously less significant contributions, such as resolution, optical interference, and focusing accuracy of alignment system, as well as from wafer processing, have to be considered. These contributions are characterized in detail in this paper. The investigation was focused on a proven optical alignment system and overlay contribution as they apply to x-ray and optical lithography. Special emphasis was made on contributions form wafer processing.

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Klaus Simon, R. Macklin, Robert A. Selzer, Olga Vladimirsky, Yuli Vladimirsky, and Franco Cerrina "Analysis and identification of factors contributing to the overlay budget", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309567

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