5 June 1998 Determining photoresist coat sensitivities of 300-mm wafers
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Abstract
This paper presents preliminary data on 300 nm wafer coatings by comparing photoresist coats on 150 nm, 200 mm and 300 mm wafers. Conventional methods of applying photoresist have ben prove effective on wafers with diameters up to 200 nm. How well 150 mm and 200 mm coating processes apply to 300 mm substrates is the focus of this paper. Spin speed versus photoresists thickness curves will be reviewed for all three wafer sizes.Additionally, two major coating uniformity factors, photoresist and cool plate temperature, will be studied for 200 mm and 300 mm wafers.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert M. Crowell, "Determining photoresist coat sensitivities of 300-mm wafers", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309595; https://doi.org/10.1117/12.309595
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KEYWORDS
Semiconducting wafers

Photoresist materials

Thin film coatings

Humidity

Control systems

Image processing

Integrated circuits

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