Paper
5 June 1998 Development of a next-generation e-beam lithography system for 1-Gb DRAM masks
Tadashi Komagata, Yasutoshi Nakagawa, Hitoshi Takemura, Nobuo Gotoh, Kazumitsu Tanaka
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Abstract
A new electron beam lithography system for masks needed in production of 1Gbit DRAM devices was developed and evaluated. The system features a variable shaped beam, 50 kV accelerating voltage, and a step and repeat stage, and incorporates new technologies, including a high resolution high current density electron optical system, a per-shot beam correction unit, a high precision beam detection system utilizing the curve fitting method, and a single-stage 20 bit beam deflection unit. The system achieves a minimum linewidth of 200 nm or less, pattern uniformity of 20 nm within field, and a positional accuracy, including field stitching accuracy, of 20nm within a field, resulting in an exposure speed at least 5 times faster than the existing model, the JBX-7000MVII.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tadashi Komagata, Yasutoshi Nakagawa, Hitoshi Takemura, Nobuo Gotoh, and Kazumitsu Tanaka "Development of a next-generation e-beam lithography system for 1-Gb DRAM masks", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309585
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Cited by 5 scholarly publications.
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KEYWORDS
Photomasks

Beam shaping

Electron beam lithography

Control systems

Lithography

Optical testing

Electron beams

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