Translator Disclaimer
5 June 1998 X ray fills the gap
Author Affiliations +
X-ray lithography has been used in mix and match mode with optical steppers to build test circuits in support of DRAM and Logic development at IBM's Advanced Semiconductor Technology Center, ASTC. Prior to building the test devices, hundreds of wafers were exposed using x-ray lithography to define the etch processes for critical levels and to help separate optical lithography, resist and etching effects. The demand for this type of support required IBM's Advanced Lithography Facility (ALF) to focus on a set of pilot line issues not previously faced by this emerging lithography. The challenges and solutions which resulted are discussed. This paper examines the requirements for the introduction of x-ray into pilot line use based on ALF's most recent experience and performance.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.


A new ZEP520 P(MMA MAA) ZEP520 trilayer process for T...
Proceedings of SPIE (January 26 2005)
UVIII-positive chemically amplified resist optimization
Proceedings of SPIE (June 04 1998)
Status Of X-Ray Lithography At H-P
Proceedings of SPIE (November 06 1983)
Present status and technical issues of x-ray lithography
Proceedings of SPIE (August 31 1998)

Back to Top