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8 June 1998 Nitride film surface properties to reduce nitride residue
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Abstract
Particles and residues occurred during Nitride (OD) layer process have serious effects on the quality for VLSI manufacturing, especially occurred in Nitride deposition and photo developing process play a main killing role of wafer yield and device function. Using KLA-2132 tool, found many Nitride residues caused field oxide missing result in yield loss. After researching, we found Nitride film surface properties have a great relationship with above residues.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fu-Tien Weng, Chih-Hsiung Lee, Kuo-Liang Lu, and Yeong-Pey Chyn "Nitride film surface properties to reduce nitride residue", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308782
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