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8 June 1998SPC tracking and run monitoring of a CD SEM
Semiconductor manufacturers should ensure that their automated critical dimension scanning electron microscopes (CD-SEMs) are maintaining run functionality in addition to providing precise and reliable measurements over time. In the past, chip manufactures have focused more on tracking measurement repeatability because testing for automated run functionality has proven difficult. A new method employing SPC monitoring, e-beam image analysis, line scan tracking, and automation testing has been developed that tests for both measurement and job repeatability. This method will extend the monitor wafer's lifetime, prove useful for day-to-day system qualification, provide a benchmark for SEM qualification following maintenance work, and become an important cornerstone of system matching.
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John A. Allgair, Dustin G. Ruehle, Richard C. Elliott, Pedro P. Herrera, John D. Miller, "SPC tracking and run monitoring of a CD SEM," Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308732