SPC tracking and run monitoring of a CD SEM

John A. Allgair; Dustin G. Ruehle; Richard C. Elliott; Pedro P. Herrera; John D. Miller

doi:10.1117/12.308732

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8 June 1998 SPC tracking and run monitoring of a CD SEM

John A. Allgair, Dustin G. Ruehle, Richard C. Elliott, Pedro P. Herrera, John D. Miller

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Proceedings Volume 3332, Metrology, Inspection, and Process Control for Microlithography XII; (1998) https://doi.org/10.1117/12.308732
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

Semiconductor manufacturers should ensure that their automated critical dimension scanning electron microscopes (CD-SEMs) are maintaining run functionality in addition to providing precise and reliable measurements over time. In the past, chip manufactures have focused more on tracking measurement repeatability because testing for automated run functionality has proven difficult. A new method employing SPC monitoring, e-beam image analysis, line scan tracking, and automation testing has been developed that tests for both measurement and job repeatability. This method will extend the monitor wafer's lifetime, prove useful for day-to-day system qualification, provide a benchmark for SEM qualification following maintenance work, and become an important cornerstone of system matching.

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John A. Allgair, Dustin G. Ruehle, Richard C. Elliott, Pedro P. Herrera, and John D. Miller "SPC tracking and run monitoring of a CD SEM", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308732

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