TIS characterization of surface roughness

Jeff A. Blau; Robert Pagliaro; Tod F. Schiff

doi:10.1117/12.308776

8 June 1998 TIS characterization of surface roughness

Jeff A. Blau, Robert Pagliaro, Tod F. Schiff

Proceedings Volume 3332, Metrology, Inspection, and Process Control for Microlithography XII; (1998) https://doi.org/10.1117/12.308776
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

Increasing demand for smoother wafer surfaces necessitates the use of metrology equipment developed for the measurement of roughness on the order of 1 Angstrom RMS over the entire surface of the sample. Much effort directed toward the refinement of using total integrated scatter (TIS) measurements as a texture measurement method has resulted in the design and implementation of a fast, non-contact measurement system able to measure surface roughness to sub-1 Angstroms RMS. As surface quality issues become more pronounced with shrinking topography specifications, manufacturing facilities needing to accurately measure texture and identify aberrations in ultra-smooth surfaces can use this technology to optimize processes and monitor process equipment. Applications to be presented include the effect of pre-clean methods, pre-bake, and bake temperatures on epitaxial deposition, using uniformity in a polysilicon layer to indicate a homogeneous temperature profile in an epitaxial reactor, macro-slip detection, setting initial and bake temperatures to drive-off native oxides, detection of backside depositions occurring during epitaxial growth that can adversely effect the backside flatness of a wafer, vendor out- of box quality control of virgin substrate, using haze measurements to identify the need for corrective or preventative maintenance in an epitaxial reactor, the identification of scratches after chemical-mechanical polish (CMP), and poor wafer handling.

Citation Download Citation

Jeff A. Blau, Robert Pagliaro, and Tod F. Schiff "TIS characterization of surface roughness", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308776

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