Application of plasma-polymerized methylsilane for 0.18-um photolithography

Cedric Monget; Carol Y. Lee; Olivier P. Joubert; Gilles R. Amblard; Timothy W. Weidman; Dian Sugiarto; John W. Yang; F. Cormont; R. L. Inglebert

doi:10.1117/12.312426

29 June 1998 Application of plasma-polymerized methylsilane for 0.18-μm photolithography

Cedric Monget, Carol Y. Lee, Olivier P. Joubert, Gilles R. Amblard, Timothy W. Weidman, Dian Sugiarto, John W. Yang, F. Cormont, R. L. Inglebert

Author Affiliations +

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312426
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

Plasma polymerized methylsilane resist films (PPMS) have high sensitivity to short wavelength radiation. The photoinduced oxidation of PPMS films exposed in air forms siloxane network material (called PPMSO), allowing dry development by selective etching of the unexposed regions upon treatment with chlorine based plasmas. Negative-tone patterns of oxidized methylsilane thus formed can be consolidated in a standard resist stripper to form SiO₂ like hard mask patterns. In this work, PPMS films are deposited using a commercial single wafer cluster tool dedicated to dielectric deposition. After exposure at 248 or 193 nm, PPMS development is performed in a commercial high density plasma source etcher. Oxide patterns obtained from PPMS films are used for organic resist patterning (bi-layer application) and gate stack patterning (single layer application).

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Cedric Monget, Carol Y. Lee, Olivier P. Joubert, Gilles R. Amblard, Timothy W. Weidman, Dian Sugiarto, John W. Yang, F. Cormont, and R. L. Inglebert "Application of plasma-polymerized methylsilane for 0.18-μm photolithography", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312426

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