29 June 1998 Photoresist performance evaluation of implant resist systems
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Abstract
Semiconductor manufacturers continue to look for better techniques to create salable devices. As with any other manufacturing entity, cost effectiveness without sacrificing quality is the key. In photolithographic manufacturing, the elements that drive the cost are raw materials, process time (throughput), and process complexity (number and iterations of process phases). The specific area being addressed by this paper is the implant layers of the semiconductor fabrication process.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David C. Pritchard, Warren Montgomery, James P. Kimball, Jeff A. Albelo, "Photoresist performance evaluation of implant resist systems", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312367; https://doi.org/10.1117/12.312367
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KEYWORDS
Semiconducting wafers

Ion beams

Photoresist materials

Ions

Manufacturing

Photoresist processing

Phase modulation

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