29 June 1998 Progress in 193-nm top-surface imaging process development
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Abstract
The maturity and acceptance of top surface imaging (TSI) technology has been hampered by several factors including inadequate resist sensitivity and silylation contrast, defects and line edge roughness and equipment performance/reliability issues. We found that the use of a chemically amplified resist can improve the sensitivity by a factor of 1.5 - 2X, without compromising line edge roughness. While the post-silylation contrast of this chemically amplified material is poor ((gamma) < 1), the post-etch contrast is excellent ((gamma) >> 10) and the use of advanced silylation chemistries (disilanes) can further reduce the dose-to-size and increase the contrast. We have also demonstrated that using sulfur dioxide in the plasma etch process can improve the sidewall passivation of the resist lines, thus reducing the overall line edge roughness. Finally, we have been able to successfully use the TSI process to pattern deep sub-micron polysilicon and metal patterns.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John M. Hutchinson, John M. Hutchinson, Veena Rao, Veena Rao, Guojing Zhang, Guojing Zhang, Adam Richard Pawloski, Adam Richard Pawloski, Carlos A. Fonseca, Carlos A. Fonseca, Janet Chambers, Janet Chambers, Susan M. Holl, Susan M. Holl, Siddhartha Das, Siddhartha Das, Craig C. Henderson, Craig C. Henderson, David R. Wheeler, David R. Wheeler, } "Progress in 193-nm top-surface imaging process development", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312405; https://doi.org/10.1117/12.312405
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