29 June 1998 Thermal stability of silicon-containing methacrylate-based bilayer resist for 193-nm lithography
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Abstract
Thermal decomposition of silyl substituted methacrylate terpolymers containing acid sensitive groups was studied using thermogravimetric analysis. The onset of decomposition was found to be a function of the microenvironment, i.e. the molar% composition of the acid sensitive group monomer. The Flynn and Wall method of estimating Ea was used to estimate the Ea for decomposition of the terpolymer and where possible, for the acid sensitive group.
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Daniela White, Daniela White, Bernard T. Beauchemin, Bernard T. Beauchemin, Andrew J. Blakeney, Andrew J. Blakeney, Thomas Steinhaeusler, Thomas Steinhaeusler, } "Thermal stability of silicon-containing methacrylate-based bilayer resist for 193-nm lithography", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312383; https://doi.org/10.1117/12.312383
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