29 June 1998 0.25-μm logic manufacturability using practical 2D optical proximity correction
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Proceedings Volume 3334, Optical Microlithography XI; (1998); doi: 10.1117/12.310749
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States
Abstract
Simplified 2-D Optical Proximity Correction (OPC) algorithms have been devised, calibrated and implemented on a state-of- the-art 0.25 micrometer random logic process in order to reduce metal line pullback on critical layers. The techniques used are rules-based, but are characterized by fast and robust data conversion algorithms, calibrations based on actual process data improvements in reticle manufacturability, and inspectability of the resultant OPC corrected reticles. Application to local interconnect and metal patterning has corrected fundamental yield-limiting mechanisms in these levels.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael E. Kling, Kevin D. Lucas, Alfred J. Reich, Bernard J. Roman, Harry Chuang, Percy V. Gilbert, Warren D. Grobman, Edward O. Travis, Paul Tsui, Tam Vuong, Jeff P. West, "0.25-μm logic manufacturability using practical 2D optical proximity correction", Proc. SPIE 3334, Optical Microlithography XI, (29 June 1998); doi: 10.1117/12.310749; https://doi.org/10.1117/12.310749
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KEYWORDS
Optical proximity correction

Reticles

Metals

Inspection

Logic

Calibration

Optical lithography

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