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21 August 1998 Large-scale W-band focal plane array developments for passive millimeter-wave imaging
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A state-of-the-art W-Band passive millimeter wave focal plane array (FPA) consisting of 1040 highly integrated direct detection pixel has been designed, developed, assembled and tested. The FPA has been integrated into a passive millimeter wave video camera and has generated real time images. Each pixel is a highly integrated MMIC chip receiver. The MMIC chip is a wide band, high gain, low noise, 0.1 micrometer InGaAs HEMT amplifier with an integrated switch and Schottky barrier diode detector. The FPA uses a brick architecture. Each brick or module consists of 4 MMIC chips or pixels and lay side-by- side on the card. Many cards are stacked to create the array of pixels. In the next generation FPA, the 1 X 4 modules and cards have been dramatically simplified with 50% less assembly time. In addition, the module and card still require no tuning and minimal test time. Thus a significant cost reduction in the FPA is expected over the first generation FPA without sacrificing performance. To further reduce cost and improve performance, new MMIC chips are being designed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roger T. Kuroda, G. Samuel Dow, Dan T. Moriarty, Ronald L. Johnson, Avery Y. Quil, Steve D. Tran, Voltaire Pajo, Steven W. Fornaca, and Larry Yujiri "Large-scale W-band focal plane array developments for passive millimeter-wave imaging", Proc. SPIE 3378, Passive Millimeter-Wave Imaging Technology II, (21 August 1998);


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