Semiconductor technology has moved in an accelerating pace. memory devices drive density and the main efforts are in cell architecture and contact shrink. Logic devices, on the other hand, drive performance and the emphases are on poly gate CD and interconnect efficiency. In this paper, logic device trends will be presented and their impact on mask making technology will be discussed. Challenges in mask blanks, poly CD control, large data file size, applications of resolution enhancement techniques will be covered. Recent market environment and its implication for mask/reticle cost consideration will also be presented. Finally challenges on a different dimension and scale in post-optical lithography mask making will be discussed.