It has been proved that the ArF lithography have a potential for 0.13 micrometers -rule production. Further application of OPC, PSM, and TSI have the possibility to enhance the ArF technology to 0.1 micrometers rule. Further research for ArF scanner, resist, process integration, resolution enhancement technologies, and photomask technology is necessary to bring ArF lithography in production use. In Selete, research program of ArF lithography has been started. The overview of Selete program is presented. This program is based on the collaboration with vendors of equipment, substrate, resist, mask, et al.