X-ray lithography (XRL) is a leading candidate among next- generation lithographic technologies for printing patterns of 130 nm and below. The years of development and feasibility studies have culminated in XRL's being used in advanced trial fabrications of devices. XRL is now at a stage requiring development and verification aimed at its practical use as an industrial technology. This is also the objective of the super-fine SR lithography laboratory of the Association of Super-Advanced Electronics Technologies (ASET). This paper reviews the present status and remaining issues for each component of XRL and presents the recent result of the Super-fine SR Lithography Laboratory of ASET. XRL has shown steady improvement in recent years, and plans to resolve the remaining issues are now being implemented.