Employing an out-of-plane coupling model for optical sub-assembly packaging applications

W. T. Chen; Lon A. Wang

doi:10.1117/12.312866

19 June 1998 Employing an out-of-plane coupling model for optical sub-assembly packaging applications

W. T. Chen, Lon A. Wang

Proceedings Volume 3420, Optical Fiber Communication; (1998) https://doi.org/10.1117/12.312866
Event: Asia Pacific Symposium on Optoelectronics '98, 1998, Taipei, Taiwan

Abstract

An appropriate analytical model which deals with out-of- plane coupling between an elliptical Gaussian beam and an angled single mode fiber is developed and utilized for two potential applications. The first one is for fast search of the optimal coupling efficiency in an optical sub-assembly packaging process while the second one is for the inspection of concentricity between the up and low tooling in an optical sub-assembly packaging system.

Citation Download Citation

W. T. Chen and Lon A. Wang "Employing an out-of-plane coupling model for optical sub-assembly packaging applications", Proc. SPIE 3420, Optical Fiber Communication, (19 June 1998); https://doi.org/10.1117/12.312866

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