5 November 1998 Advancements in E-O framing
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This paper reviews the origin, at the start of this decade, of Electro-Optic (E-O) framing technology. It follows the development of the 4-, 25-, and 50-Mpixel focal plane arrays (FPAs) which incorporate on-chip electronic forward motion compensation (FMC). These FPAs enable intelligence-quality performance under dynamic tactical maneuvers. Current technology has extended E-O framing into the infrared (IR) spectrum with the introduction of the world's largest IR FPA, a newly 4-Mpixel Platinum Silicide (PtSi) array. The future of E-O framing is being defined by two new United States patents announced in this paper. "Profiled" FMC provides the ability to enhance on-chip FMS using near real time image correlation. The process also yields a powerful "Precision Strike" capability by generating precision geo-location information which can be quickly transmitted to today's precision weapons. The second patent makes use of aircraft INS information to generate two-dimensional vectors. These vectors can be applied to a unique two-dimensional FPA image motion compensation architecture. Two-axis motion compensation improves the robustness of E-O framing cameras to dynamic aircraft maneuvers. The text describes compensation performance for rates of 30° per second in roll, and 10° per second in pitch and yaw with less than 2-pixels of blur over the entire array.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andre G. Lareau, Andre G. Lareau, } "Advancements in E-O framing", Proc. SPIE 3431, Airborne Reconnaissance XXII, (5 November 1998); doi: 10.1117/12.330192; https://doi.org/10.1117/12.330192


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