26 October 1998 Infrared imager employing a 160 x 120 pixel uncooled bolometer array
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We have developed an uncooled thermal imager having 160 X 120, 50 micrometer X 50 micrometer pixels which operates at 30 Hz frame rate. It employs a complementary metal oxide silicon (CMOS) redout integrated circuit (ROIC) beneath a vanadium oxide (VOx) silicon microstructure bolometric array. Imagery output is in RS-170 format. An RS-232 port can be employed to command operation from a remote location. Weight of the 'engine,' consisting of the focal plane array in is package plus three circuit boards, each 3 X 3 inches, is 8 oz. Input power is 2.5 Watts. Also included on the boards is a circuit which avoids the need for a temperature stabilizer in the array package. Operating in the 8 - 14 micrometer spectral interval, the imager has a noise equivalent temperature difference (NETD) with an f/0.8 lens against 295 K targets of less than or equal to 0.1C. The dynamic range of 66 dB will accommodate very hot targets without saturation of an image which also contains 290 K targets.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul W. Kruse, Paul W. Kruse, Randy Dodson, Randy Dodson, Shane Anderson, Shane Anderson, Lee Kantor, Lee Kantor, Mike Knipfer, Mike Knipfer, Timothy J. McManus, Timothy J. McManus, R. Andrew Wood, R. Andrew Wood, Tom Rezachek, Tom Rezachek, } "Infrared imager employing a 160 x 120 pixel uncooled bolometer array", Proc. SPIE 3436, Infrared Technology and Applications XXIV, (26 October 1998); doi: 10.1117/12.328056; https://doi.org/10.1117/12.328056

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