Testing of readout device processing electronics for IR linear and focal plane arrays

Fiodor F. Sizov; Yurii P. Derkach; Yu. G. Kononenko; Vladimir P. Reva

doi:10.1117/12.327995

26 October 1998 Testing of readout device processing electronics for IR linear and focal plane arrays

Fiodor F. Sizov, Yurii P. Derkach, Yu. G. Kononenko, Vladimir P. Reva

Author Affiliations +

Proceedings Volume 3436, Infrared Technology and Applications XXIV; (1998) https://doi.org/10.1117/12.327995
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1998, San Diego, CA, United States

Abstract

For preliminary selection of the silicon read-out devices designed for applications in hybrid mercury-cadmium-telluride (MCT) IR linear or matrix arrays manufactured according to flip-chip technology, there was designed constructions of the testing circuits imbedded into the read-out devices to test them before hybridization. Also the procedure of their testing at room temperature without attachment to the MCT photo- voltaic multielement arrays was developed. There were designed some types of multielement silicon read-out devices with input direct injection and buffered direct injection circuits and charge coupled devices (CCD) multiplexers to be used with n⁺-p- or p⁺-n-photodiodes with dynamical resistance at reverse bias R greater than or equal to 10⁷ (Omega) . Into these read-out devices there were incorporated the testing switches which attach the sources of direct injection transistors to the common load resistors to imitate the output signal of MCT photodiodes. The silicon read-out devices for 2 X 64 linear arrays and 2 X 4 X 128 (144) TDI arrays with direct and buffered direct charge injection were manufactured by n-channel MOS technology with CCD register with buried channel. By changing the frequency of the control impulses here were investigated the characteristics of the read-out devices for time delay and integration (TDI) arrays in the regime of integration and without it (in TDI channel).

Citation Download Citation

Fiodor F. Sizov, Fiodor F. Sizov, Yurii P. Derkach, Yurii P. Derkach, Yu. G. Kononenko, Yu. G. Kononenko, Vladimir P. Reva, Vladimir P. Reva, } "Testing of readout device processing electronics for IR linear and focal plane arrays", Proc. SPIE 3436, Infrared Technology and Applications XXIV, (26 October 1998); doi: 10.1117/12.327995; https://doi.org/10.1117/12.327995

ACCESS THE FULL ARTICLE

PERSONAL SIGN IN
Full access may be available with your subscription

Email or Username Forgot your username?

Password Forgot your password?

Show

Remember Email/Username on this computer

Remember Password

No SPIE account? Create an account
or Institutional Sign In via Shibboleth

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $14.40

Non-members: $18.00 ADD TO CART

Show All Keywords

Keywords/Phrases

Search In:

Publication Years