In the frame of technological preparation for scientific Earth observation programs, the European Space Agency (ESA) has undertaken breadboarding activities dedicated to hyperspectral imager to be implemented on a Low Earth Orbit satellite. Based on the lessons learned during the previous breadboarding phase, a SWIR focal plane breadboard has been studied and developed in the 1 to 2.35 micrometer range and was extensively characterized for demonstration of both performances and mechanical buttability. The hybrid technology is based on photovoltaic, HgCdTe diodes arrays coupled to full custom, CMOS, silicon, multiplexing circuitry dedicated to the hyperspectral imager requirements. Due to system constraint, the focal plane is operated at 150 K, and read-out at 3.3 Mpixels/s. Results of the characterization will be presented, with particular emphasis about the read-out noise, the dark current and its non uniformity, plus the linearity as a function of flux.