13 October 1998 Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing
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Surface polysilicon micromachined micromirrors require ultra-flat surfaces for advance optical applications such as adaptive optics. This paper details the planarization of micromirrors using chemical-mechanical polishing. We show that the increase in topography is due to a high temperature anneal step downstream for the CMP process itself. Two process alternatives were investigated: (1) perform a CMP step after the high temperature anneal step, and (2) perform a CMP step on a final polysilicon mirror surface. Both process alternatives produced acceptable flatness requirements for micromirror applications.
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Dale L. Hetherington, Dale L. Hetherington, Jeffry J. Sniegowski, Jeffry J. Sniegowski, } "Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing", Proc. SPIE 3440, Photonics for Space Environments VI, (13 October 1998); doi: 10.1117/12.326692; https://doi.org/10.1117/12.326692

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